[EUREKA or EUROSTARS] A Korean company is looking for R&D partners to develop copper sintered material for power semiconductor package bonding
A Korean company providing material solution for electrode packages is looking for R&D partner for developing copper sintered material for semiconductor package bonding. With the partner that has knowledge and expertise in reduction of copper surface oxide film, the Korean company is going to apply for EUREKA or EUROSTARS programme under research cooperation agreement.